Events, Manufacturers
Danfoss to Showcase End-to-End Solutions for AI-ready Data Centers at Supercomputing 2026

Danfoss will highlight its broad portfolio of data center cooling, power, controls, and energy management technologies at Supercomputing (SC) 2026, November 16-19 in Chicago, Illinois. At booth 4823, Danfoss will demonstrate solutions that help data center operators maximize performance, improve efficiency and reliability, and support sustainability goals under the theme, “You run the data. We keep it cool.”
As AI and high-performance computing drive unprecedented growth in data center demand, operators face increasing pressure to deliver greater performance while managing energy consumption and infrastructure complexity. With more than 30 years of experience, Danfoss serves as a strategic partner for data center companies looking to scale quickly and optimize efficiency. The company’s solutions optimize the entire data center ecosystem, supporting both white space and gray space applications from grid to rack to heat recovery.
Danfoss works alongside customers throughout the design and development process, helping accelerate time to market, reduce risk, and future-proof infrastructure for the next generation of AI-ready facilities. Through integrated technologies and application expertise, the company enables operators to increase computing performance while turning sustainability into a competitive advantage.
Danfoss will launch several new products at SC, including:
- Danfoss Hansen® FD83 2.5-inch quick-disconnect coupling. Extending the trusted FD83 liquid cooling platform, the coupling delivers nearly twice the flow, reduced pressure drop, and a compact size-to-flow ratio. Designed for higher-density AI deployments, the coupling helps prepare data centers for future cooling architectures.
-

Danfoss – SC26 – 7G Crimp Fittings DataCryo™ 7G crimp fittings, which provide a secure, qualified connection for data center liquid cooling systems. Engineered for seamless compatibility with DataCryo DC394 and EHW194 hoses, the fittings help ensure reliable coolant transport from source to chip while supporting system performance and uptime.
- CoolTrain™ 2, a customizable, plug-and-play solution for up to 233 kW of liquid cooling power in data centers. It connects and optimally balances coolant flow to the server racks using a flexible hose and stainless steel pressure-independent smart control valve.
- Danfoss e-QC and e-PC stainless steel smart control valves. These valves electronically balance and control server rack liquid cooling flows up to 333 lpm (88 gpm), maintaining constant flow (e-QC) or differential pressure (e-PC), with an integrated UL-certified NovoCon® M2 digital actuator providing dynamic control and DCIM telemetry.
Danfoss will also showcase key technologies and recently launched products, such as the DataCryo hose series, two-phase liquid cooling solutions, Turbocor® compressors with active cooling, hydronic balancing technologies, and iC7-HVACR ultra-low harmonic drives and iC7 liquid-cooled system modules providing unrivalled power density for 800/1,500 VDC applications.

In addition, visitors will have the opportunity to learn about Danfoss’ latest research, including the recently published report, Data centers: A new lever of flexibility, integration, and security. The paper explores how data centers can strengthen grid resilience, enable energy flexibility, and accelerate decarbonization efforts.
As part of the event’s Exhibitor Forum, Danfoss experts Estela Nario and Atul Puranik will present, Scaling Liquid Cooling for AI Infrastructure: The Critical Role of Interoperability, Cleanliness, Traceability, and Ecosystem Alignment. In their presentation, Nario and Puranik will explore how these elements influence deployment reliability, operational efficiency, and long-term scalability. The session will be held Wednesday, November 18, at 10:30am in room W194b.
“Danfoss combines three decades of liquid cooling expertise with one of the industry’s broadest data center portfolios, helping customers address the challenges of AI-driven growth,” said Peter Bleday, Vice President, Data Center Solutions, Danfoss Power Solutions. “By working closely with our customers from design through deployment, we’re helping them build data center infrastructure that delivers the performance, reliability, and efficiency needed for the future of computing. We look forward to welcoming visitors to our booth and discussing how Danfoss can support their growth.”
For more information, visit Danfoss at SC in booth 4823 or online: Danfoss solutions for data centers.
About Danfoss: Danfoss engineers solutions that increase machine productivity, lower energy consumption, enable electrification, and reduce emissions.
Our solutions are used in areas such as refrigeration, air conditioning, heating, power conversion, motor control, industrial machinery, automotive, marine, and off- and on-highway equipment. We also provide solutions for renewable energy, such as solar and wind power, Power-to-X, heat recovery, as well as contribute to district energy solutions for cities.
Our innovative engineering dates back to 1933. Danfoss is family-owned and employs over 39,000 people. We create long-term value for our customers in more than 100 countries with a global footprint of around 100 factories.
For further information please contact:
Lindsay Schleisman, Senior Program Manager, Public Relations
Phone: +1 952-250-0604
Email: lindsay.schleisman@danfoss.com
Danfoss | danfoss@danfoss.com | www.danfoss.com






